27. Oktober 2026 · 04:48 Uhr
ASML and TSMC have launched a joint initiative to develop 12-inch photomasks for High-NA EUV – with a pilot line by 2031 and mass production at advanced nodes by 2033. This is a critical infrastructure step that enables the next generation of sub-2nm chips in the first place and further cements ASML's monopoly position in the EUV ecosystem.
The merger between Skyworks Solutions and Qorvo is officially complete; management is targeting over $500 million in synergies and a combined gross margin of 50–55%. The combination of the two RF chip giants creates a new dominant supplier for mobile and IoT semiconductors and significantly increases consolidation pressure in the RF segment.
Nvidia CEO Jensen Huang publicly warns that US export controls have unintentionally accelerated China's independent development of AI chips – a direct critique of the effectiveness of the US strategy. The statement carries strategic weight as Nvidia, as the primary affected party, speaks and could force a reassessment of export control policy.
The US Department of Commerce has signed formal letters of intent for $389 million in CHIPS Act funding to four companies, including vertical GaN and ultra-high-purity quartz technologies – now with concrete contract partners confirmed. This goes beyond the previously announced announcement as the letter of intent represents a binding milestone in the funding process.
Infineon Technologies has announced it will sell its NOR Flash and F-RAM business to Taiwanese memory chip supplier Winbond Electronics. The deal signals a strategic focus by Infineon on power semiconductors and automotive segments, while Winbond deliberately expands its memory portfolio breadth.
The $21 billion fab project in New York, where Japan provides financing and GlobalFoundries provides operations, establishes a new geopolitical cooperation model for semiconductor factories among allies. Simultaneously, the original CHIPS Act allocation of $955 million was redirected – away from conventional fab capacity, toward silicon photonics and specialty technologies at GF.
The semiconductor industry is experiencing simultaneous technological density at the top and geopolitical fragmentation along alliance lines: ASML and TSMC are laying the groundwork for sub-2nm manufacturing by 2033 with the High-NA EUV photomasks initiative, while competing foundries Intel, Samsung, and TSMC are collaborating for the first time at the Applied Materials EPIC Center. US export control strategy faces pressure – Nvidia CEO Huang publicly attests to its counterproductivity, as it has accelerated China's independent chip development, and new US Treasury rules on outbound investments intensify the escalation spiral further. In parallel, a new financing model for fab capacity is emerging in which allies like Japan provide capital and US operators like GlobalFoundries manage operations – a pattern that institutionalizes the security logic of chip geopolitics and puts Europe's Chips Act strategy under adjustment pressure.
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