Semicon Briefing

SK Hynix is making the construction of a new US semiconductor fab contingent on Washington approving the export of US manufacturing equipment to its Dalian facility in China – an unprecedented lever against the US government. The deal directly links geopolitically sensitive export control issues with CHIPS Act objectives and puts Washington in a bind between its reshoring agenda and China containment policy.

ASML is implementing a 10% price increase on spare parts starting in January – Samsung and SK Hynix have reportedly accepted, but TSMC already resisted a DUV price increase in July. The development demonstrates ASML's growing market power and increases cost pressure on chip manufacturers, particularly for older DUV fabs.

Infineon has completed the acquisition of C2i Semiconductors to expand its innovation capabilities in AI datacenter power management – a strategic move into one of the fastest-growing semiconductor subsectors. The deal strengthens Infineon's position against US competitors like Texas Instruments and onsemi in the booming power management segment.

ON Semiconductor has officially filed the merger with Synaptics via a merger sub structure with the SEC – the transaction from June 25, 2026 is thus formally sealed. The deal expands onsemi's portfolio with HMI and edge AI chips and intensifies competition with Cirrus Logic in the automotive and consumer segments.

South Korean private equity fund Stonebridge Capital has acquired semiconductor equipment supplier Foures Co. for 200 billion won (~$140 million USD). The transaction reflects sustained high M&A activity in the chip equipment segment, driven by global fab expansion and competition for specialized supply chains.

The US Department of Commerce signals a strategic shift: instead of further fab subsidies, US chipmakers should now be actively supported in winning manufacturing orders and utilizing newly built capacity. The pivot suggests that Washington recognizes capacity utilization risks at CHIPS Act fabs as a growing problem.