Semicon Briefing

As part of a US-Japanese government agreement, GlobalFoundries will operate two new chip fabs in Malta, New York – with an investment volume of up to $21 billion USD. The first fab is expected to add approximately 900,000 300-mm wafers annually to US manufacturing capacity and significantly strengthens American supply chain resilience.

ASML CFO Roger Dassen confirms diverging adoption timelines: Intel and SK Hynix are already using High-NA EUV productively, Samsung follows in 2028, TSMC not until 2030 – the technology is still in a 'very early ramp phase' according to Dassen. The staggered timelines shift competitive advantages and structurally influence ASML's revenue planning.

The merger of Skyworks and Qorvo is officially complete; management targets over $500 million in synergies and a combined gross margin of 50–55%. Jim Cramer recommends the stock at $82 as a buying opportunity – a signal that the market views integration risks as manageable.

Quantum computing company IonQ acquires a cybersecurity provider for up to $1.3 billion USD, thereby linking quantum hardware with security software at the deal level for the first time. The move signals that quantum computing players are increasingly building vertical stacks – with direct relevance to future chip and cryptography standards.

Infineon divests its NOR-Flash and F-RAM business in favor of Winbond, thereby sharpening its strategic focus on core growth areas such as power, automotive, and AI infrastructure. The deal underscores the trend toward portfolio rationalization among European semiconductor conglomerates under margin pressure.

The US regulatory authority FCC has scheduled a vote for October 29 on new restrictions for Chinese labs that test electronic devices for the American market. The measure would significantly impact the certification pipeline for semiconductor end products from China and represents another escalation step in the tech trade war.