28. September 2026 · 03:48 Uhr
Broadcom and Samsung sign a Memorandum of Understanding worth $200 billion for memory and foundry services through 2030 – the largest foundry framework agreement by volume in industry history. Bernstein warns of near-term earnings headwinds at Samsung despite the deal; UBS views the pact as Broadcom's strategic hedge against TSMC dependency in the AI silicon segment.
The Trump administration lifts the Biden-era export ban on Nvidia's H200 GPU to China and secures 25% of profits from China sales in return – a paradigm shift in US chip export policy. Critics warn that China gains access to the previously strongest permitted AI accelerators, while Blackwell and Rubin remain restricted.
ASML Executive Vice President Frank Heemskerk publicly confirms that ASML sold not a single lithography system in Europe in 2026 – despite the €43 billion EU Chips Act framework. New: The European Commission released a Chips Act 2.0 draft with 'Demand Accelerators' on June 3; EU industry ministers debated the reform on September 24, significantly increasing political pressure.
Anderon receives a finalized CHIPS Act award worth $1 billion to expand superconducting quantum wafer manufacturing – a rare example of US state-funded quantum hardware scaling. Dependency on IBM as sole major customer is seen as critical risk; Anderon plans external design wins to meet funding requirements.
Navitas Semiconductor agrees to acquire Claros Technologies (spinout from the defense-tech ecosystem of Red Cell Partners and General Catalyst) for up to $232.8 million – a move combining GaN power semiconductors with hardened defense AI processors. The deal expands Navitas' addressability in security-critical data centers and military applications.
The official fact sheet from the US-China summit contains no agreements on chips, semiconductor equipment, or export controls according to Politico analysis – core technological disputes remain unresolved. The CFR notes that China's promised 'de facto lifting' of its own mineral export controls was not publicly confirmed, further undermining the credibility of the summit outcome for the chip industry.
The semiconductor industry is experiencing simultaneous escalation on three fronts during the week of September 23–28, 2026: Geopolitically, the Trump decision to free Nvidia H200 exports to China while demanding 25% of profit from China sales marks a fundamental break with Biden's export control philosophy – while the Xi-Trump summit conspicuously excluded the real sticking points (Blackwell, ASML equipment, BIS rules). Technologically and industrially, ASML consolidates its lithography monopoly with High-NA EUV commitments from TSMC, Samsung, and Intel, while zero sales in Europe document the failure of EU industrial policy in the most critical technology field. Strategically, the $200 billion Broadcom-Samsung MoU shifts foundry power dynamics noticeably: TSMC loses a systemically relevant hyperscaler anchor to its Korean competitor for the first time, recalibrating competition for 2nm AI silicon capacity starting in 2027. For Europe and Western chip supply security, the overall picture remains concerning: the US relies on deal-based control rather than rules-based export restrictions, Europe builds fabs without demand, and China increases its semiconductor equipment imports by 16% despite all restrictions – a sign of accelerated self-sufficiency ambitions.
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