22. September 2026 · 03:48 Uhr
Infineon has sold its NOR Flash and F-RAM business to Taiwanese manufacturer Winbond Electronics for $1.12 billion – closure is planned for the second half of 2027. The deal sharpens Infineon's focus on core growth areas (Automotive SiC, Power, Security) and transfers a leading automotive NOR franchise to a specialist.
New is the specification of production timelines: Samsung starts High-NA EUV DRAM mass production in 2028, TSMC Logic from 2030 – Intel is already in high-volume manufacturing. This solidifies the technology roadmap for all three major logic and memory companies, significantly strengthening ASML's order pipeline and revenue visibility through 2030.
The exchange period for the $22 billion RF chip merger has been extended to September 25, 2026; closing is still expected within calendar year 2026. The delay signals regulatory or shareholder-related hurdles near the finish line – failure would have significant consequences for the global RF semiconductor market.
The U.S. Department of Commerce awarded a finalized CHIPS Act grant of $375 million to GlobalFoundries on September 18, 2026 for establishing onshore-capable quantum semiconductor manufacturing. This is a new, previously unreported CHIPS closing and marks the first government-backed quantum fab initiative in the United States.
On September 16, the Commerce Department finalized a CHIPS Award of up to $1 billion for Anderon, a newly formed IBM subsidiary, complemented by an equivalent IBM equity investment of $1 billion. The project aims to establish U.S. advanced packaging and semiconductor manufacturing and shows that CHIPS funds are now flowing into the second wave of strategic industrial projects.
Investigative research demonstrates that Chinese entities, despite being on the U.S. blacklist, systematically obtain export-restricted Nvidia AI chips through renamed subsidiaries (e.g., Aivres as Inspur successor). The finding intensifies pressure on BIS to strengthen end-user verification requirements for semiconductor supply chains and threatens the credibility of the entire U.S. export control regime.
The semiconductor industry is in a phase of strategic consolidation and technological transition: The binding specification of High-NA EUV production timelines by TSMC, Samsung, and Intel through 2030 cements ASML's monopoly position as the sole supplier of the most critical manufacturing technology of the next decade. In parallel, evidence is mounting that U.S. export controls toward China are being systematically circumvented – posing significant geopolitical escalation risks and pushing Congress toward tightening measures. The CHIPS Act funding wave is rolling into its second phase with new awards for IBM and GlobalFoundries, while Europe attempts to close structural capacity gaps through Chips Act 2.0 and ARM membership in the EU design platform. Market concentration on ASML, TSMC, and a handful of U.S. fabs as critical infrastructure remains the dominant security policy risk of global chip supply.
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