17. September 2026 · 03:48 Uhr
TSMC and Samsung officially confirmed on September 7th/8th that they will adopt ASML's High-NA EUV machines (approximately $400 million each) – Samsung for DRAM from 2028, TSMC for logic from 2030. This means all three leading foundries are now on board with the world's most expensive and powerful lithography platform, massively securing ASML's roadmap and order backlog.
Intel and SK Hynix are negotiating a joint venture for memory chip production in the US according to Reuters – the use of Intel's planned Ohio fab site is under discussion. New compared to the previously reported site acquisition: this is now about an operational JV with ongoing US production, which drove INTC pre-market +5% and SK Hynix +4%.
Infineon is acquiring US startup C2i Semiconductors to expand its innovation capabilities in the field of AI datacenter power management. The deal complements Infineon's ongoing restructuring (sensor business sale to Infineon via ams-OSRAM) and signals a strategic reorientation toward AI infrastructure.
Apple has accepted Samsung's memory pricing offer for Q1 2027 – with a price increase of 30 to 40% compared to Q1 2026. This signals significant supply tightening in the premium DRAM segment and is likely to exert margin pressure on device manufacturers.
New data shows: China will cover ~32% of global wafer capacity from its own production by 2026 and has significantly reduced its import share – US export controls have paradoxically accelerated localization. In parallel, Chinese customs authorities are actively blocking approved H200 deliveries, further straining US-China AI summit talks.
The EU Competitiveness Council meets on September 24th on Chips Act 2.0 and reveals as a key innovation so-called 'Demand Accelerators' – structured procurement contracts between chipmakers and European industrial customers that are meant to replace pure subsidy policy. This is a paradigmatic policy shift: without secured demand, new fabs are considered economically unfeasible.
The semiconductor industry is experiencing a simultaneous convergence along three strategic axes in the week of September 12–17, 2026: First, TSMC and Samsung's confirmation for ASML's High-NA EUV cements Western technological leadership in lithography and makes this platform the de facto standard of the next chip generation. Second, the Intel-SK Hynix JV suggests accelerated restructuring of US manufacturing capacity, in which Korean capital and expertise fill the gap in Ohio created by Intel's weakness. Third, China's chip self-sufficiency is progressing faster than Western policy analysts had expected – export controls are acting as an innovation accelerator for domestic suppliers and simultaneously undermining the effectiveness of further restrictions, placing considerable pressure on the ongoing US-China AI summit. Europe is attempting with Chips Act 2.0 and the Demand Accelerator approach to shift from pure subsidy logic to market-driven industrial policy – whether this succeeds in time will determine the competitiveness of European fabs through 2030.
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