Semicon Briefing

TSMC reports a revenue surge of 68% in June 2026, confirming sustained AI-driven demand. The foundry bottleneck remains structurally intact – Polymarket sees Q2 revenue above $40 billion already at 100% probability.

Infineon has completed the acquisition of ams OSRAM's non-optical analog/mixed-signal sensor business for €570 million – ams OSRAM will henceforth focus on Digital Photonics. The acquired business expects ~€230 million annual revenue in 2026 and is immediately EPS-accretive.

TSMC is so overwhelmed with advanced packaging capacity (CoWoS) that orders are spilling over to Intel and other Taiwanese fabs – a concrete turning point for Intel's foundry relevance. This significantly strengthens Intel's position as a backup supplier for AI chip packaging.

TSMC, ASML, and imec have successfully realized n- and p-type 2D material transistors on 300mm wafers with 50nm contacted poly pitch for the first time – a breakthrough toward industrial manufacturing beyond silicon. According to Digitimes, the partners plan mass production readiness in Taiwan within five years.

Micron commits $500 million to GlobalWafers' Texas silicon wafer facility, securing domestic raw material supply – coupled with an additional $275 million CHIPS Act funding from the Commerce Department. Goal: 40% of DRAM production in the US by 2035.

Polymarket values the probability that Apple will source memory chips from CXMT in 2026 at 58% – despite US export control risks, CXMT is not on the Entity List. According to reports, Apple is exploring diversification away from Samsung/SK Hynix, which is geopolitically highly sensitive.