19. Juni 2026 · 03:48 Uhr
Trump officially announced a partnership between Apple and Intel for joint chip development and production in the US – Intel stock jumped 9% as a result. New details include confirmation that the US holds approximately 10% stake in Intel and Intel's CEO position was filled with ex-SK Hynix CEO Seok-Hee Lee, which is intended to accelerate Intel's foundry transformation.
ams-OSRAM is divesting its non-optical sensor business (automotive, industrial, medical) for 570 million euros in cash to Infineon – closing is imminent after the German Federal Cartel Office has been reviewing since March. The deal sharpens Infineon's sensor portfolio and provides significant financial relief to ams-OSRAM, with expected halving of interest costs by 2028.
The EU Commission has published the draft for Chips Act 2.0 with a volume of 120 billion euros, which for the first time anchors photonics as a strategic sector and envisions a European leading-edge fab for 2-nm chips. Critics warn that Europe's core needs lie in 28/22-nm nodes and a 2-nm focus misses industrial reality.
IQE and Tower Semiconductor have signed a multi-year supply contract for indium phosphide epiwafers and simultaneously settled all pending IP disputes. The deal secures Tower Semiconductor's growth in InP silicon photonics and gives IQE predictable minimum purchase commitments – a signal for increasing importance of InP in AI high-performance interconnects.
New details on TSMC Arizona supply chain confirm ASML as sole EUV supplier and Applied Materials as key supplier; additionally, TSMC is cooperating with Applied Materials on the 5-billion-dollar EPIC Center for AI chip manufacturing. TSMC also reported 30-percent revenue growth in May 2026 (YoY) and expanded its US production commitments.
Lattice Semiconductor has completed an agreement to acquire AMI (leading provider of platform firmware and infrastructure manageability for cloud and AI) from THL Partners for $1.65 billion in cash and stock. The transaction combines Lattice's low-power FPGAs with AMI's firmware expertise and positions the combined company as a comprehensive provider for AI infrastructure control.
The semiconductor industry is experiencing a condensation of geopolitically motivated industrial policy this week: The US is formalizing its strategy for bringing critical chip manufacturing back home through the Apple-Intel deal and a state Intel stake, while the EU is institutionalizing its own sovereignty paths with Chips Act 2.0 and the Infineon Dresden fab. Simultaneously, the European semiconductor industry is consolidating through M&A (ams-OSRAM/Infineon, Lattice/AMI), pointing to structural change toward vertically integrated players. The persistent TSMC capacity shortage at advanced nodes is driving a reordering of global foundry alliances – with Samsung as the main beneficiary – and increasing pressure on Intel to quickly prove its foundry credibility under new leadership. From a security perspective, US export controls against China and China's countermeasures on raw materials (tungsten, rare earths) are intensifying the risk of technological bifurcation, which is likely to structurally fragment global supply chains in the long term.
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