8. Juni 2026 · 03:48 Uhr
The US has approved H200 chip sales to 10 Chinese companies (including Alibaba, Tencent, ByteDance) – but on the condition that 25% of revenue flows to the US government as license fees and chips must physically pass through US territory. Export controls are thus being effectively restructured into a state revenue model, fundamentally shifting the geopolitical paradigm.
Huawei's chairman publicly stated that US export restrictions have massively boosted China's semiconductor self-development – backed by Huawei's new LogicFolding architecture and SMIC's establishment of an Advanced Packaging Institute in Shanghai. This is a direct strategic acknowledgment: containment policy has achieved the opposite of its intended effect.
SK Group (SK Hynix) and TSMC have signed a formal cooperation agreement for HBM4 development and advanced packaging, with SK Hynix's HBM4 on TSMC's 12-nm base dies. The alliance targets the custom AI memory market directly and solidifies TSMC's role as an indispensable partner in the AI supply chain ecosystem.
Japan's state-backed chip manufacturer Rapidus has completed an additional financing round of $943 million, advancing its 2-nm fab construction. The round signals that Japan continues to invest massively in semiconductor sovereignty despite significant technical and timeline risks.
TSMC's Co-COO publicly stated the company has no fear of Intel's packaging technology (EMIB-T/Foveros), while JP Morgan simultaneously analyzed that TSMC is deliberately allocating more capacity to AMD and Nvidia at Intel's expense. The combination of official nonchalance and structural disadvantaging of Intel in capacity allocation intensifies Intel's Foundry business survival struggle.
Samsung Electronics and SK Hynix each lost around 10% at the week's open, accompanied by broad sell-off in US semiconductor equities. The decline reflects growing skepticism about whether AI-driven demand justifies current valuation levels – especially as TSMC itself warns that supply will not meet demand for years to come.
Semiconductor geopolitics has reached a new escalation level: Washington has effectively converted chip export controls versus China into a license revenue model (25% revenue share), while Huawei publicly confirmed that previous sanctions have accelerated China's self-development – including new chip architectures and packaging capacity – rather than slowed it. Simultaneously, the Western supply chain is consolidating: TSMC deepens its HBM alliance with SK Hynix, Europe mobilizes €120 billion through the Chips Act 2.0, and Japan's Rapidus secures nearly another billion dollars in funding. The market correction in Samsung and SK Hynix signals that investors increasingly differentiate between politically-steered demand forecasts and actual purchasing power – a risk that could recalibrate the entire AI semiconductor cycle.
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