3. Juni 2026 · 03:48 Uhr
MediaTek confirms that its next flagship program will exclusively use Intel's EMIB-T Advanced Packaging – a significant design win for Intel Foundry. At the same time, MediaTek's CEO reaffirms TSMC as a long-term partner, highlighting the tension between the two foundries over contracts.
The US Department of Commerce clarified in unusual weekend guidance that export licenses for advanced AI chips (Blackwell/Rubin) also apply to Chinese subsidiary operations outside China – closing the previous offshore workaround. This significantly escalates the tech cold war and directly impacts Nvidia, AMD, and the global AI infrastructure supply chain.
The EU is expected to join the US-led chip alliance 'Pax Silica' to counter China's catch-up in the AI sector – though France and other members criticize this as a threat to European technological sovereignty. The move comes parallel to the Chips Act 2.0 debate and signals a fundamental split in European tech strategy.
Intel and 3D Glass Solutions have signed a $3.3 billion contract with the Indian state of Odisha for a semiconductor substrate manufacturing facility – India's largest single chipmaking investment to date. The deal positions India as an alternative to Taiwan and China supply chains and strengthens Intel's global manufacturing footprint.
Infineon's €570 million acquisition of the non-optical analog and mixed-signal sensor portfolio from ams-OSRAM is approaching closing in Q2 2026 – the antitrust authority has been reviewing since March, a decision expected daily. The acquired business is expected to generate around €230 million in revenue in 2026 and strengthens Infineon's position in AI datacenter hardware, robotics, and automotive versus NXP and STMicroelectronics.
Analog Devices is reportedly close to a roughly $1.5 billion acquisition of Empower Semiconductor to strengthen its position in AI infrastructure. The deal underscores ongoing consolidation pressure in the analog/mixed-signal segment, where chipmakers are using acquisitions to quickly build AI-relevant power management expertise.
The semiconductor industry is experiencing simultaneous escalation on multiple fronts: the US has closed a key loophole in China chip export controls, elevating the technology cold war to a new level, while Huawei breakthrough reports show that sanctions are accelerating China's indigenous development rather than slowing it. Geopolitically, a new bloc structure is forming – 'Pax Silica' with EU participation on one side, an increasingly autonomous Chinese chip ecosystem on the other. Meanwhile, massive investment offensives are underway: India enters as a serious manufacturing location for the first time with the Intel-3DGS deal, Europe is struggling with €120 billion Chips Act ambitions to prove credibility, and Intel wins a strategically important packaging customer with the MediaTek EMIB-T deal. In the M&A segment, the frequency of deals (Infineon/ams-OSRAM, Analog Devices/Empower) signals accelerated consolidation driven by AI demand and pressure to secure critical manufacturing competencies in-house.
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