Semicon Briefing

Samsung and SK Hynix have combined to order approximately $16 billion in ASML EUV systems to address exploding HBM/DRAM demand driven by AI and fill the gap left by TSMC's decision to forgo High-NA EUV. ASML raises its 2026 revenue guidance to €36–40 billion; South Korea accounts for nearly half of Q1 revenues.

Samsung has placed its first production order for silicon photonics modules and plans mass production in H2 2026; CPO focus follows around 2029. The move positions Samsung directly against TSMC's CoWoS/SoIC ecosystem and represents a significant step in optical chip interconnect infrastructure for AI data centers.

The Karnataka cabinet has approved 140 acres in Bengaluru Signature Park for Applied Materials – for a combined R&D and semiconductor infrastructure center. The deal signals accelerated TSMC supply chain diversification to India and strengthens India's position as an alternative semiconductor hub.

Jabil (JBL) and Sivers Semiconductors announced a strategic partnership for AI optics production on April 15, 2026, with an addressed volume of 1.6 trillion LRO. The collaboration underscores the trend toward vertical integration of optical components in AI chip supply chains.

Infineon is accelerating its India expansion through new OSAT and foundry partnerships – a greenfield fab is explicitly excluded. In parallel, Infineon is strengthening its position in wide-bandgap/SiC through a tie-up with Zenergize, sharpening the company's automotive and industrial semiconductor strategy.

The European Semiconductor Manufacturing Company in Dresden – a joint venture of TSMC, Bosch, Infineon, and NXP – is concretizing its investment planning at over €10 billion combined, with half publicly funded via the EU Chips Act. In parallel, Austria is providing €227 million for ams-OSRAM; the project demonstrates for the first time how EU Chips Act support is being translated into real construction projects.