Semicon Briefing

TSMC's 3nm manufacturing capacity is so heavily overloaded that multiple chip design firms are actively considering a shift to Samsung Foundry. This represents a direct market gain for Samsung and signals that structural demand for advanced-node manufacturing exceeds global supply.

Micron Technology has officially completed its acquisition of the Powerchip Semiconductor facility in Tongluo, Taiwan, and announces a second AI memory fab. The move significantly strengthens Micron's HBM and DRAM capacity for the AI market and intensifies competition with Samsung and SK Hynix.

Infineon Technologies has officially acquired key assets from ams-OSRAM's Premstätten operations – the deal was filed on March 3, 2026 under reference V-31/26 and focuses on sensors and integrated solutions. The transaction drives the ams-OSRAM share price upward and solidifies Infineon's position in the sensor segment for automotive and AI applications.

Infineon and DG Matrix have announced a strategic partnership for SiC-based solid-state transformers for AI data centers; Infineon share subsequently rose 3.51%. The deal underscores that semiconductor technology is increasingly defining the power infrastructure of the AI boom.

Semtech (NASDAQ: SMTC) completed its acquisition of HieFo Corporation for $34 million on March 17, 2026. The acquisition expands Semtech's portfolio in specialized chip IPs and is part of a broader consolidation trend in the mid-cap semiconductor segment.

EPIC Microsystems from San José completed a Series A round of $21 million to develop power delivery solutions specifically for AI infrastructure. The funding reflects growing investor focus on power delivery as a critical bottleneck in the AI data center stack.