Semicon Briefing

Analog Devices has signed an agreement to acquire Alif Semiconductor for $1.35 billion in cash. The deal strengthens ADI's portfolio in edge AI and embedded MCU/MPU chips and signals further consolidation pressure in the analog segment.

Applied Materials has signed an agreement to increase its stake in BE Semiconductor Industries (BESI) to approximately 20 percent of outstanding shares to deepen the long-term strategic partnership in advanced packaging. BESI is a key supplier of die-bonding systems – the stake secures AMAT privileged access to critical packaging technology for AI chips.

ON Semiconductor has officially completed the acquisition of Synaptics Incorporated through a merger subsidiary, as indicated in the SEC 8-K filing from June 2026. The acquisition significantly expands onsemi's position in automotive connectivity and intelligent sensing.

STMicroelectronics has brought its new 200-mm silicon carbide manufacturing line at the Catania facility into production in the second quarter of 2026 – following a delay from the originally planned Q4 2025. SiC is a key material for electric vehicle inverters and industrial applications; the production ramp strengthens Europe's competitive position against Asian SiC suppliers.

New reports show that US sanctions effectively cut off Chinese NAND makers like YMTC from global customer relationships despite technical advances – Apple did not proceed with corresponding YMTC plans. At the same time, a new BIS rule for Blackwell chips took effect in January 2026, further restricting license access for China.

GlobalFoundries plans to begin construction of a new fab in Malta, New York later this year, expanding an already upgraded $16 billion US expansion program financed by $1.5 billion from the CHIPS Act. The groundbreaking marks a concrete milestone for US semiconductor sovereignty beyond TSMC's Arizona investments.