Semicon Briefing

Samsung will use TSMC's 3nm process for the first time to manufacture base dies for Nvidia's next generation of custom HBM chips (NVHBM) – a historic break with Samsung's previous turnkey model. The trigger is Samsung's SF2 yields of only 50–60%, roughly 40 percentage points below TSMC; TSMC thus becomes the sole logic partner for all premium AI memory programs on Nvidia's roadmap.

Applied Materials has opened its $5B EPIC Center in Sunnyvale, where TSMC, Intel, Samsung, Micron, and SK Hynix share research space for the first time – including Intel and TSMC as direct foundry competitors on the same research floor. The model marks a paradigm shift in semiconductor R&D: pre-competitive collaboration is intended to dramatically shorten development cycles for AI chips.

Samsung has expanded its High-NA EUV partnership with ASML, thus industrially validating the technology; Intel's wafer milestone and TSMC's 2030 plans strengthen demand prospects for ASML's next-generation lithography. ASML simultaneously reported record Q3 revenues of €11.7B (+55% YoY) and is reviewing capacity expansions, as planned delivery volumes cannot fully meet customer demand for the next two years.

AMD has completed its acquisition of World Labs, the spatial AI startup founded by AI pioneer Fei-Fei Li, for $8.2B and aims to integrate spatial AI models and physical world simulation into its AI chip ecosystem. The deal positions AMD directly against Nvidia's growing software and model ecosystem and signals convergence of chip hardware and foundation model competency.

Taiwan has tightened export controls for AI chips to China as part of its free trade agreement with the US – violations will henceforth be prosecuted as criminal offenses under the Foreign Trade Act. In parallel, Taiwan is planning a $4B complex in Texas for Nvidia's AI supply chain, further accelerating the geopolitical shift of semiconductor value creation away from the Taiwan Strait.

Infineon has signed a multi-year supply agreement with troubled US SiC manufacturer Wolfspeed for 200mm silicon carbide wafers, thus securing substrate supply for AI power management and electric mobility. The deal stabilizes Wolfspeed financially and solidifies Infineon's market leadership in the SiC segment, while AI data centers emerge as a second major demand component alongside EVs.