Semicon Briefing

TSMC will raise its manufacturing prices by up to 10% in 2027 – driven by AI demand and market dominance. Meanwhile, planned price increases for ASML Low-NA EUV machines are frustrating TSMC, intensifying cost pressure across the entire supply chain.

Both companies officially denied sales or acquisition discussions for Intel's Ohio fab, but did not rule out a joint venture. The incident reveals massive pressure on Intel to monetize its US manufacturing capacity and SK Hynix's interest in US onshoring of DRAM production.

TSMC Chairman C.C. Wei confirmed an additional $100 billion investment package for Arizona – with at least four additional 2nm fabs and advanced packaging, total volume now $265 billion. This is the largest private single contribution to US chip manufacturing to date and a direct result of the US-Taiwan trade agreement.

Applied Materials signed a 10-year contract for advanced AI packaging with TSMC while simultaneously acquiring NEXX. The agreement ties a significant portion of AMA's tool demand directly to TSMC's AI foundry roadmap and strengthens AMA's position as a systemic supplier.

ASML's CEO traveled to Korea to negotiate EUV equipment with Samsung leadership for next-gen DRAM and advanced foundry products. Given Samsung's lag behind TSMC and SK Hynix in the HBM market, the partnership is a strategic key step for Samsung's catch-up effort.

Infineon closed the acquisition of ams OSRAM's non-optical analog/mixed-signal sensor business for €570 million on July 1, 2026. ams OSRAM will focus on digital photonics going forward; Infineon's sensor portfolio grows by approximately €230 million in annual revenue and strengthens Europe's automotive/industrial semiconductor position.