Semicon Briefing

The EU plans with the Chips Act II (draft expected end of May) for the first time direct investments by the EU Commission in cross-border chipfactories – a paradigm shift away from pure research subsidies. The goal is to accelerate stalled fab projects and reduce Europe's dependence on Asian chip production.

Lattice Semiconductor ($LSCC) has signed a definitive agreement to acquire AMI (THL Partners) for $1.65 billion – combined with Q1 revenue growth of 42%. The deal is considered transformative for Lattice's position in the embedded computing and industrial chip market.

Applied Materials has signed a definitive agreement to purchase the NEXX business from ASMPT Limited to strengthen its position in advanced packaging for AI chips. The deal directly targets growing demand for high-performance chip packaging in the AI infrastructure segment.

ams-OSRAM divests its non-optical analog/mixed-signal sensor business (approximately €230 million annual revenue, ~230 employees) for €570 million to Infineon – closing subject to German Federal Cartel Office expected in Q2 2026. The deal sharpens ams-OSRAM's focus on digital photonics and cuts interest costs in half according to management.

The US Department of Commerce has instructed American equipment companies to stop deliveries to China's second-largest foundry operator Hua Hong – Beijing warns that the global supply chain will break for everyone. China has in parallel since late 2025 mandated that chipfactories use at least 50% domestic equipment, further accelerating decoupling dynamics on both sides.

Tesla has taped its AI5 chip in a joint partnership with TSMC and Samsung; for successor AI6, Intel's advanced packaging is also under discussion. The targeted nine-month design cycles signal that Tesla is massively accelerating its own development rhythm for AI silicon.