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Semicon Briefing

March 31, 2026 · 03:49 Uhr

1

TSMC 2nm Booked Through 2028 – Samsung as Fallback Solution

chosun.com

TSMC's 2-nanometer process is completely booked through 2028, positioning Samsung Foundry as an alternative. This marks a structural capacity crisis for the world-leading foundry and could accelerate Samsung's comeback in the foundry market.

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2

US Chip Security Act: Congress Tightens AI Chip Export Restrictions

digitimes.com

The US House Committee on Foreign Affairs passed the Chip Security Act, which further restricts high-performance computer exports to China – an escalation beyond previous H200 regulations. Potentially all Western semiconductor manufacturers with China business are affected.

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3

$170 Million Chip Smuggling: US Citizen and Chinese National Indicted

townhall.com

Three individuals were indicted for a $170 million scheme to illegally export US AI chips to China – a sign of how strongly market pressure from US export controls is fueling illegal channels. The case underscores growing prosecution intensity in the chip export control regime.

4

Marvell Sells Automotive Ethernet Division for $2.5 Billion

r/investing_discussion

Marvell divests its automotive ethernet business for $2.5 billion, signaling strategic focus on AI data center chips. The market is watching closely how the released capital will be reinvested.

5

EU Chips Act 2.0: Industry Demands Ecosystem Over Individual Subsidies

eetimes.com

With the new EU Chips Act, industry representatives are calling for a paradigm shift: away from subsidizing individual fabs, toward a competitive European semiconductor ecosystem. Specifically, only capacities should be supported that are economically viable and strategically indispensable for European end users.

6

Japanese Power Chip Alliance: Rohm, Toshiba & Mitsubishi Sign MoU

powersemiconductorsweekly.com

Toshiba, Rohm, and Mitsubishi Electric signed a memorandum of understanding for integrating their power semiconductor divisions – a potential counterweight to Infineon and other Western market leaders. The merger would create one of the world's largest power semiconductor conglomerates and reshape the global market.

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Situation Report

The semiconductor industry is under pressure during the week of March 26–31, 2026, from accelerating fragmentation along geopolitical fault lines: TSMC's booked-out 2nm capacity through 2028 forces major customers to diversify to Samsung, while the US Congress tightens the export control framework with the Chip Security Act – despite ongoing H200 shipments to China. Simultaneously, the $170 million smuggling case shows that sanctions loopholes are actively exploited and prosecution is increasing significantly. Strategically, new alliances are forming: in Japan, a three-way merger in power semiconductors is reshaping the market; in Europe, industry is pushing for a competitive Chips Act 2.0 ecosystem; and Marvell's automotive sale signals the entire industry's focus shift toward AI infrastructure.

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