Semicon Briefing

On September 8, 2026, TSMC, Samsung, and Intel formally signed commitments for ASML's High-NA EUV systems – including joint development of 12-inch photomasks intended to boost wafer output by 40%. Samsung targets DRAM high-volume production by 2028; Bank of America rates this as the strongest roadmap confirmation for AI chips in years.

The Irish EU Council presidency released a first compromise draft for Chips Act 2.0 that relaxes requirements for companies to identify supply threats – experts discuss on October 7. Background: ASML sold zero EUV systems in Europe in 2026, exposing the purely supply-side subsidy strategy as a strategic failure.

TSMC is reportedly considering a partnership with Musk's Terafab and a second US industrial park in Texas, with a 35% manufacturing tax credit through year-end required for construction start. The potential Texas campus would complement the $165 billion Arizona GigaFab and further diversify US chip manufacturing away from Taiwan.

AMD CEO Lisa Su plans a Korea visit in October; Samsung is the preferred HBM4 supplier for the Instinct MI455X and has additionally activated a DDR5 co-development agreement from the March MOU. This is a substantial materialization of the previously reported MOU and strengthens Samsung's position in the HBM market versus SK Hynix.

Infineon and Eaton have signed a formal partnership for silicon carbide technology to develop solid-state transformers for 800-VDC AI data center architectures. The deal positions Infineon as a key supplier for booming AI infrastructure and creates a further growth pillar following the ams-OSRAM sensor acquisition.

Micron has announced a $200–260 billion investment plan for US memory fabs directly tied to tariff and CHIPS Act incentives – together with TSMC's additional $100 billion, this represents the largest semiconductor investment package ever announced on US soil. The announcements signal a lasting shift of global manufacturing capacity away from Asia.